A chiplet is a modular, specialized integrated circuit die that’s unpackaged. It can be combined with other modular integrated circuits using advanced packaging to create a more complex system-on-chip (SoC) or multi-die design.

A chiplet represents a transformative advancement in semiconductor technology – a compact, unpackaged silicon die designed for modular integration with other chiplets. These building blocks form sophisticated system-on-chip (SoC) and multi-die architectures when combined through advanced packaging. This approach enables customized, high-performance systems tailored for specific applications and helps mitigate cost/yield limits as transistor scaling slows. Arteris is propelling the industry forward with standards-based, automated and silicon-proven solutions optimized for seamless integration across intellectual property (IP) cores, chiplets and complete SoCs.

Benefits of Chiplets

  • Chiplets are leveraged for greater flexibility, efficiency, and scalability in chip design and enable designers to optimize specific characteristics. Designers can pick and choose the appropriate chiplets for different applications.
  • By reusing existing chiplets in various combinations across different products, more chiplets can address higher workload demands and reduce time to market without the need for a complete redesign.
  • Chiplets are associated with increased yield and reduced die cost.
  • The key to a successful chiplet design lies in the interconnect technology to ensure high bandwidth, low latency and power efficiency, making the chiplet approach viable for high-performance applications.
  • Arteris’ expanded multi-die solution offers a suite of enhanced technologies purpose-built for scalable and faster time-to-silicon, high-performance computing, and automotive-grade mission-critical designs.
Monolithic Die Challenges vs Chiplet Advantages

Construction and Use Cases

  • 2.5D packaged chiplets use silicon, glass or organic interposers on a substrate for the critically important interconnect IP. 3D chiplets stack dies vertically, and are most mature for high-bandwidth memory (HBM).
  • Built for interoperability, the expanded Arteris solution supports the Universal Chiplet Interconnect Express (UCIe) specification, various Arm AMBA protocols, PCIe, and integration with leading physical IPs to ensure robust, standards-based ecosystem compatibility.
  • Currently, chiplets are largely used in data centers, high-performance computing (HPC) and for artificial intelligence (AI).
  • Chiplets offer flexibility, which helps designers meet reliability and safety requirements with dies that have already been proven in previous designs. Note that the reliability qualification of multi-die packages is still an active research area.
multi-die designs solution

Arteris and Chiplets

  • Arteris delivers cutting-edge solutions empowering semiconductor designers to leverage chiplet-based architectures, ensuring scalable performance and design flexibility across multiple market segments.
  • The company’s product portfolio supports emerging industry standards such as UCIe(Universal Chiplet Interconnect Express), enabling interoperability and accelerating semiconductor manufacturers’ time to market.
  • Arteris collaborates with leading ecosystem partners, including foundries, EDA vendors, and third-party IP providers, to enable best-in-class chiplet integration.
  • The company regularly participates in chiplet standardization initiatives, contributing technical expertise to industry consortia for shaping the future of heterogeneous integration.
  • Technical documentation, customer support, and continuous innovation stand at the forefront of Arteris’ commitment to its partners and users, reinforcing product reliability and market relevance.
  • Looking ahead, Arteris invests in research to advance multi-die architectures, AI-centric SoCs, and next-generation connectivity solutions, sustaining leadership as semiconductor technology evolves.
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Solution Brief
Accelerate AI-Driven Silicon Innovation with Arteris Multi-Die Solution
The Arteris Multi-Die Solution delivers flexible design scalability for chiplet-based systems, optimal PPA, highest quality-of-results (QoR), functional safety and broad standards support to achieve the fastest time to silicon.

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