Consumer Electronics
Meeting aggressive schedule demands with efficient, scalable, and low power system IP
Overview
Overview
Unforgiving schedule challenges drive Consumer markets – missing specific seasons like Christmas can decide company destinies – and developing semiconductor components for consumer applications is an intricate task riddled with numerous challenges, including cost pressures due to the extreme price sensitivity of end applications. In addition, consumer electronics are trending towards being smaller, lighter, and more portable, while consumers expect simultaneous increased functionality and performance. Power consumption and heat management are paramount as devices become smaller and more powerful, and consumers demand devices with longer battery life that do not overheat.
With Arteris’ NoC and SoC Integration technologies, developers de-risk their projects to meet the aggressive schedule demands of consumer markets while optimizing area usage with physically aware optimization, leading to the lowest power implementation to meet end-user cost and battery life expectations.

Advantages
Key Benefits
Lorem Ipsum is simply dummy text of the printing and typesetting industry.
Time to Market
Arteris technology helps speed up the design process. Rapid design and development cycles give companies a significant competitive advantage in the fast-paced consumer technology sector.
Optimized PPA
Arteris' interconnect IP solutions optimize consumer systems' performance, power consumption, and cost, allowing semiconductor vendors to meet the expectations of end users of consumer applications.
Advanced SoC Integration
Arteris' solutions aid developers in addressing the challenges of integrating multiple heterogeneous processing elements, memory systems, and communication interfaces into a single SoC.
Arteris revolutionizes semiconductor design with
FlexGen - smart NoC IP
FlexGen’s built-in AI/ML-driven automation enables the generation of optimized NoC designs for complex SoCs, delivering expert-level results.
- 10x Productivity Boost
- Expert-Level Results
- Up to 30% Wire Length Reduction
Realize faster time-to-market, optimized power plus performance, and improved overall design economics with FlexGen.
Products
Products
Lorem Ipsum is simply dummy text of the printing and typesetting industry.
Customers
Trusted by innovative companies everywhere

Resources
Resources
Lorem Ipsum has been the industry’s standard dummy text ever since the 1500s, when an printer.
- Magillem Registers – Automate the Hardware/Software Interface for Fast Chip Design
- Accelerating Timing Closure for Networks-on-Chip (NoCs) using Physical Awareness
- Optimizing Data Transport Architectures in RISC–V SoCs for AI/ML Applications
- FlexGen Product Tour
- Cache Coherency in Heterogeneous Systems
- Integration Challenges for RISC-V Designs
- Promises and Pitfalls of SoC Restructuring
- Scaling Performance in AI Systems
- Architecting the Future of Deep Learning Presentation
- Arm & Arteris AI and ISO 26262 Presentation
- Arm TechCon: Implementing ISO 26262 Compliant AI Systems-on-Chip with Arm and Arteris
- Automating the Generation of Scalable and Reusable FMEDA in Complex Systems-on-Chip (SoCs)
- Building Better IP with RTL Architect NoC IP Physical Exploration
- Efficient Scaling of AI Accelerators Using NoC Tiling
- Implementing Low-Power AI SoCs Using NoC Interconnect Technology
- Implementing Machine Learning & Neural Network Chip Architectures
- ISO 26262: What to Expect From Your Chip or IP Provider
- Routing Congestion: The Growing Cost of Wires
- Safety Considerations for Network-on-Chip (NoC) Development
- The Role of Networks-on-Chips Enabling AI/ML Silicon and Systems
- Tiled Approach to System Scaling
- Using Synopsys Z01X to Accelerate the Fault Injection Campaign of a Fully Configurable IP
- Electronic Design: All About NoCs
- SemiWiki: A Broad View of Design Architectures and the Role of the NoC with Arteris’ Michal Siwinski
- EE Journal: The Freedom to Innovate: Arteris and the Rise of RISC-V
- EE Journal: The Network-on-Chip Pioneer: How Arteris Enabling SoC Developers to Create Physically Valid NoCs Faster
- SemiWiki: The Impact of Using a Physically Aware NoC with Charlie Janac
- Power Dissipation of the Network-on-Chip in a System-on-Chip for MPEG-4 Video Encoding
- Re-Architecting SoCs for the AI Era
- Routing Congestion: The Growing Cost of Wires
- Scalability – A Looming Problem in Safety Analysis
- Security in Artificial Intelligence
- Using Machine Learning for Characterizations of NoC Components
- Using Virtual Prototypes to Improve the Traceability of Critical Embedded Systems Flow
[rank_math_breadcrumb]
Meeting aggressive schedule demands with efficient, scalable, and low power system IP
Call to action 2
Consumer Electronics
Sign Up
Overview
Overview
Unforgiving schedule challenges drive Consumer markets – missing specific seasons like Christmas can decide company destinies – and developing semiconductor components for consumer applications is an intricate task riddled with numerous challenges, including cost pressures due to the extreme price sensitivity of end applications. In addition, consumer electronics are trending towards being smaller, lighter, and more portable, while consumers expect simultaneous increased functionality and performance. Power consumption and heat management are paramount as devices become smaller and more powerful, and consumers demand devices with longer battery life that do not overheat.
With Arteris’ NoC and SoC Integration technologies, developers de-risk their projects to meet the aggressive schedule demands of consumer markets while optimizing area usage with physically aware optimization, leading to the lowest power implementation to meet end-user cost and battery life expectations.
Call to action 1
Advantages
Key Benefits
Lorem Ipsum is simply dummy text of the printing and typesetting industry.
Time to Market
Arteris technology helps speed up the design process. Rapid design and development cycles give companies a significant competitive advantage in the fast-paced consumer technology sector.
Optimized PPA
Arteris’ interconnect IP solutions optimize consumer systems’ performance, power consumption, and cost, allowing semiconductor vendors to meet the expectations of end users of consumer applications.
Advanced SoC Integration
Arteris’ solutions aid developers in addressing the challenges of integrating multiple heterogeneous processing elements, memory systems, and communication interfaces into a single SoC.
Latest Innovation
Arteris revolutionizes semiconductor design with FlexGen – smart NoC IP
FlexGen’s built-in AI/ML-driven automation enables the generation of optimized NoC designs for complex SoCs, delivering expert-level results.
- 10x Productivity Boost
- Expert-Level Results
- Up to 30% Wire Length Reduction
Realize faster time-to-market, optimized power plus performance, and improved overall design economics with FlexGen.
Explore FlexGen
https://vimeo.com/1054310823
Products
Products
Lorem Ipsum is simply dummy text of the printing and typesetting industry.
Customers
Trusted by innovative companies everywhere
View All Customers

Resources
Resources
Lorem Ipsum has been the industry’s standard dummy text ever since the 1500s, when an printer.
- Magillem Registers – Automate the Hardware/Software Interface for Fast Chip Design
- Accelerating Timing Closure for Networks-on-Chip (NoCs) using Physical Awareness
- Optimizing Data Transport Architectures in RISC–V SoCs for AI/ML Applications
- FlexGen Product Tour
- Cache Coherency in Heterogeneous Systems
- Integration Challenges for RISC-V Designs
- Promises and Pitfalls of SoC Restructuring
- Scaling Performance in AI Systems
- Architecting the Future of Deep Learning Presentation
- Arm & Arteris AI and ISO 26262 Presentation
- Arm TechCon: Implementing ISO 26262 Compliant AI Systems-on-Chip with Arm and Arteris
- Automating the Generation of Scalable and Reusable FMEDA in Complex Systems-on-Chip (SoCs)
- Building Better IP with RTL Architect NoC IP Physical Exploration
- Efficient Scaling of AI Accelerators Using NoC Tiling
- Implementing Low-Power AI SoCs Using NoC Interconnect Technology
- Implementing Machine Learning & Neural Network Chip Architectures
- ISO 26262: What to Expect From Your Chip or IP Provider
- Routing Congestion: The Growing Cost of Wires
- Safety Considerations for Network-on-Chip (NoC) Development
- The Role of Networks-on-Chips Enabling AI/ML Silicon and Systems
- Tiled Approach to System Scaling
- Using Synopsys Z01X to Accelerate the Fault Injection Campaign of a Fully Configurable IP
- Electronic Design: All About NoCs
- SemiWiki: A Broad View of Design Architectures and the Role of the NoC with Arteris’ Michal Siwinski
- EE Journal: The Freedom to Innovate: Arteris and the Rise of RISC-V
- EE Journal: The Network-on-Chip Pioneer: How Arteris Enabling SoC Developers to Create Physically Valid NoCs Faster
- SemiWiki: The Impact of Using a Physically Aware NoC with Charlie Janac
- Power Dissipation of the Network-on-Chip in a System-on-Chip for MPEG-4 Video Encoding
- Re-Architecting SoCs for the AI Era
- Routing Congestion: The Growing Cost of Wires
- Scalability – A Looming Problem in Safety Analysis
- Security in Artificial Intelligence
- Using Machine Learning for Characterizations of NoC Components
- Using Virtual Prototypes to Improve the Traceability of Critical Embedded Systems Flow
All Resources