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Announcements

Press Releases

Stay informed with the latest announcements on Arteris’ key achievements, strategic partnerships, and game-changing innovations.

Aug 26, 2025

Arteris Joins UALink Consortium to Accelerate High-Performance AI Networks Scale Up

Arteris joins UALink Consortium to accelerate high-performance AI networks scale up, bringing its world-class expertise in network-on-chip IP and SoC integration automation software to this industry group.

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Aug 19, 2025

Arteris Wins Gold Stevie® Award for Most Innovative Tech Company of the Year

Arteris Wins Gold Stevie® Award for Most Innovative Tech Company of the Year, Plus Silver and Bronze Honors, in the 2025 International Business Awards®

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Aug 4, 2025

Arteris To Provide FlexGen Smart NoC IP In Next-Generation AMD AI Chiplet Designs

Arteris’ FlexGen smart NoC IP will be utilized by AMD in semiconductor designs to enable improved product performance and efficiency.

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Jul 22, 2025

Arteris Selected by Whalechip for Near-Memory Computing Chip

FlexNoC 5 network-on-chip interconnect IP from Arteris licensed by Whalechip, providing connectivity and enabling superior performance, area, and power for custom ASIC.

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Articles

Blogs

Connect with expert insights, emerging trends, and in-depth analysis driving the evolution of the semiconductor industry.

Aug 28, 2025

Semiconductor Engineering: A Smarter Path To Chiplets Through An Enhanced Multi-Die Solution

With monolithic SoCs reaching their limits, chiplet-based architectures are key to building flexible, high-performance systems. Arteris’ multi-die solution combines silicon-proven NoC IP, cache coherency, and automation tools to streamline chiplet integration and accelerate time-to-market. Learn more in the article.

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Aug 27, 2025

RISC-V: Arteris’ Multi-Die Solution for the RISC-V Ecosystem

As AI, HPC, and automotive workloads push past the limits of monolithic SoCs, chiplet-based design offers a scalable and cost-efficient path forward. Arteris enables this shift with advanced NoC IP for coherent and non-coherent multi-die interconnects, UCIe-based die-to-die links, and

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Jul 31, 2025

Semiconductor Engineering: System Integration With Standards-Based Automation

As SoCs evolve into complex multi-die systems, standards-based automation is key. Learn how IP-XACT and Arteris’ Magillem tools enable consistent metadata, scalable IP reuse, and faster, error-free integration across teams and tools.

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Jul 28, 2025

EDN: Chiplet design basics for engineers

As AI and HPC workloads intensify, engineers are turning to chiplet-based architectures to overcome the limitations of traditional SoCs. This article explains the fundamentals of chiplet design, its advantages, and the tools enabling scalable, high-performance multi-die systems.

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Jul 16, 2025

EE Times: Smarter SoC Design for Agile Teams and Tight Deadlines

Advanced NoC automation helps lean SoC teams meet tight deadlines by reducing complexity, cutting design time, and improving power and performance efficiency.

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Jun 25, 2025

Design & Reuse: Enabling Chiplet Design Through Automation and Integration Solutions

Explore how chiplet-based designs overcome SoC limitations. Arteris’ multi-die solution enables connectivity across chiplets, supporting coherent and non-coherent traffic and intelligent dataflow management.

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