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Magillem Packaging datasheet thumbnail
Datasheet

Magillem Packaging Datasheet

  • True IP Reuse methodology with comprehensive IP, subsystem and chiplet packaging in a reusable pivot…
Accelerating IP Reuse
Video

Accelerating IP Reuse

Semiconductors now rely on up to 1,000 third-party IPs in complex SoCs, requiring seamless integration. Insaf Meliane of Arteris discusses with Semiconductor Engineering how the latest IP-XACT version simplifies automation, abstraction, and system integration.

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