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Semiconductor Engineering: A Smarter Path To Chiplets Through An Enhanced Multi-Die Solution
With monolithic SoCs reaching their limits, chiplet-based architectures are key to building flexible, high-performance systems. Arteris’ multi-die solution combines silicon-proven NoC IP, cache coherency, and automation tools to streamline chiplet integration and accelerate time-to-market. Learn more in the article.
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RISC-V: Arteris’ Multi-Die Solution for the RISC-V Ecosystem
As AI, HPC, and automotive workloads push past the limits of monolithic SoCs, chiplet-based design offers a scalable and cost-efficient path forward. Arteris enables this shift with advanced NoC IP for coherent and non-coherent multi-die interconnects, UCIe-based die-to-die links, and
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EDN: Chiplet design basics for engineers
As AI and HPC workloads intensify, engineers are turning to chiplet-based architectures to overcome the limitations of traditional SoCs. This article explains the fundamentals of chiplet design, its advantages, and the tools enabling scalable, high-performance multi-die systems.
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Semiconductor Engineering: Reducing SoC Power With NoCs And Caches
The growing complexity of integrating multiple processing elements, memory systems and communication interfaces into a single SoC demands innovative solutions to optimize power efficiency. Arteris offers a comprehensive suite of IP products, including FlexNoC, Ncore and CodaCache that address these
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Design & Reuse: Accelerating SoC Evolution With NoC Innovations Using NoC Tiling for AI and Machine Learning
A new trend is emerging in the design of high-end, multi-billion-transistor system-on-chip (SoC) devices and it is called “NoC tiling”. It’s an innovative approach that facilitates scaling, condenses design time, speeds testing, and reduces risk.
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