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A Smarter Path To Chiplets Through An Enhanced Multi-Die Solution
Semiconductor Engineering: A Smarter Path To Chiplets Through An Enhanced Multi-Die Solution
With monolithic SoCs reaching their limits, chiplet-based architectures are key to building flexible, high-performance systems. Arteris’ multi-die solution combines silicon-proven NoC IP, cache coherency, and automation tools to streamline chiplet integration and accelerate time-to-market. Learn more in the article.
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Arteris’ Multi-Die Solution for the RISC-V Ecosystem
RISC-V: Arteris’ Multi-Die Solution for the RISC-V Ecosystem
As AI, HPC, and automotive workloads push past the limits of monolithic SoCs, chiplet-based design offers a scalable and cost-efficient path forward. Arteris enables this shift with advanced NoC IP for coherent and non-coherent multi-die interconnects, UCIe-based die-to-die links, and
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Magillem Packaging workflow
Semiconductor Engineering: System Integration With Standards-Based Automation
As SoCs evolve into complex multi-die systems, standards-based automation is key. Learn how IP-XACT and Arteris’ Magillem tools enable consistent metadata, scalable IP reuse, and faster, error-free integration across teams and tools.
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Why Chiplets Win for Al-based Semiconductors
EDN: Chiplet design basics for engineers
As AI and HPC workloads intensify, engineers are turning to chiplet-based architectures to overcome the limitations of traditional SoCs. This article explains the fundamentals of chiplet design, its advantages, and the tools enabling scalable, high-performance multi-die systems.
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chip with brain
EE Times: Smarter SoC Design for Agile Teams and Tight Deadlines
Advanced NoC automation helps lean SoC teams meet tight deadlines by reducing complexity, cutting design time, and improving power and performance efficiency.
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advantages of Arteris multi-die solution
Design & Reuse: Enabling Chiplet Design Through Automation and Integration Solutions
Explore how chiplet-based designs overcome SoC limitations. Arteris’ multi-die solution enables connectivity across chiplets, supporting coherent and non-coherent traffic and intelligent dataflow management.
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chiplet design
EDN: Chiplet basics: Separating hype from reality
Planning chiplet-based designs is underway. Yet, uncertainty continues to swirl around chiplet architecture and ready-to-use technologies. New innovations are on the horizon.
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Modern SoCs Require Multiple NoCs For Optimal Performance
Design & Reuse: Automating NoC Design to Tackle Rising SoC Complexity
Modern SoCs typically include between 5 and 20 individual NoC instances, consuming around 10–13% of the total silicon area. However, existing methodologies, especially in light of growing register demands, are proving inadequate. This leads to extended development cycles, frequent design
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Magillem Registers provides a single source of truth
Semiconductor Engineering: CSR Management: Life Beyond Spreadsheets
The hardware-software interface (HSI) that’s physically represented by control and status registers (CSRs) is a critical source of design risk. Mismanagement of CSRs contributes to a number of SoC failures. To avoid these setbacks, engineering teams need a robust, automated
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AI cube
EDN: Boosting RISC-V SoC performance for AI and ML applications
Modern SoC designs are more innovative and complex than ever, therefore RISC-V-based designs must address challenges like interoperability, hardware-software integration, and safety certifications to meet stringent performance and reliability standards. Learn more in this article.
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